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Dir, Package Design Engineering

Renesas Electronics

Taichung, TaiwanFull Time

Renesas Electronics

Posted 2026-07-30

About the role

Job Description Responsibilities: Lead the global Packaging Sustaining Engineering organization supporting high-volume semiconductor manufacturing across internal assembly sites and OSAT partners throughout Asia, ensuring manufacturing excellence, customer satisfaction, yield, quality, reliability, cost competitiveness, and strategic supplier management. Responsible for Ja…

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